发明名称 ENCAPSULATION OF A DEVICE
摘要 An encapsulation for an electrical device (100) is disclosed. A cap support (130) is provided in the non-active regions (120) of the device (100) to prevent the package from contacting the active components (110) of the devic e due to mechanical stress induced in the package.
申请公布号 CA2342946(A1) 申请公布日期 2001.01.18
申请号 CA19992342946 申请日期 1999.07.09
申请人 OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG 发明人 GUENTHER, EWALD KARL MICHAEL
分类号 G09F9/30;H01L21/44;H01L27/32;H01L33/00;H01L51/52 主分类号 G09F9/30
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