发明名称 |
Continuous, non-agglomerated adhesion of a seed layer to a barrier layer |
摘要 |
<p>A method and apparatus is provided for improving adherence of metal seed layers to barrier layers in electrochemical deposition techniques. The method includes depositing an adhesion layer continuously or semi-continuously without agglomeration onto a barrier layer prior to depositing a seed layer by controlling the substrate temperature, the chamber pressure, and/or the power delivered to a deposition chamber. Deposition of the adhesion layer prevents layer delamination which leads to agglomeration of the deposited layers and formation of voids in the high aspect ratio features. <IMAGE></p> |
申请公布号 |
EP1069612(A2) |
申请公布日期 |
2001.01.17 |
申请号 |
EP20000305493 |
申请日期 |
2000.06.29 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
GANDIKOTA, SRINIVAS;TAO, RONG;CHEN, LIANG-YUH;RAMASWAMI, SESHADRI |
分类号 |
C23C14/06;C23C14/14;C23C14/34;H01L21/203;H01L21/28;H01L21/285;H01L21/3205;H01L21/768;H01L23/52;(IPC1-7):H01L21/768 |
主分类号 |
C23C14/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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