<p>An acid copper electroplating composition comprising an aqueous solution of an acid and a copper salt, wherein at least one carrier compound, a water-soluble, mercapto-containing organic brightener compound and a leveller compound which comprises an organic compound containing single or multiple charged centres are present.</p>
申请公布号
EP1069211(A2)
申请公布日期
2001.01.17
申请号
EP20000305941
申请日期
2000.07.13
申请人
THE BOC GROUP, INC.
发明人
WANG, QING MIN;HUANG, WEIJI;LAU, MIU LING;LIU, CAROL HSIUCHIN;MA, CE;CHANG, EDWARD K.;HO, WENPIN;PACIEJ, RICHARD C.
