发明名称 Mixtures of epoxy resins and their use
摘要 <p>The invented epoxy resin mixtures for producing preforms and composite industrial materials providing refractory forming substances with high temperature of glass transition an at the same time exhibiting enhanced interlaminar adherence and adherence to copper, contain the following components: phosphorus-modified epoxy resin with epoxy value ranging from 0.02 to 1 mole/100 g built of structural units derived from (A) polyepoxy compounds with at least two epoxy groups per one molecule and (B) at least one compound being selected from a group comprising phosphinic acids, phosphonic acids, pyrophosphonic acids and semiesters of phosphonic acids, - aromatic polyamine as a hardening ingredient.</p>
申请公布号 CZ287737(B6) 申请公布日期 2001.01.17
申请号 CZ19950002246 申请日期 1994.03.10
申请人 SIEMENS AKTIENGESELLSCHAFT;HOECHST AKTIENGESELLSCHAFT 发明人 VON GENTZKOW WOLFGANG;HUBER JUERGEN;KAPITZA HEINRICH;ROGLER WOLFGANG;KLEINER HANS JERG
分类号 B05D7/24;B29C39/00;B32B27/38;C08G59/14;C08G59/18;C08G59/20;C08G59/30;C08G59/32;C08G59/40;C08G59/50;C08J5/24;C08K5/3477;C08L63/00;C09D163/00;H01B3/40;H05K1/03;(IPC1-7):C08G59/14 主分类号 B05D7/24
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