发明名称 Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronics parts
摘要 <p>Heat-conductive and pressure-sensitive adhesive sheets which are excellent in heat resistance, scarcely undergo anchoring fracture between the base material and the adhesive layer and, therefore, are usable in fixing electronic parts to heat-radiating members or fixing members in various fields including constructive materials, vehicles, aircrafts and ships. the heat-conductive and pressure-sensitive adhesive sheets are in the form of sheets, tapes, etc. wherein a layer of a heat-conductive and pressure-sensitive adhesive composition, which contains an alkyl (meth)acrylate polymer having hydrophilic groups, is formed on the high frequency sputter-etched surface(s) of a plastic film containing 2 to 50 % by volume of a heat-conductive, electrical insulating filler.</p>
申请公布号 EP0872532(B1) 申请公布日期 2001.01.17
申请号 EP19980106971 申请日期 1998.04.16
申请人 NITTO DENKO CORPORATION 发明人 OURA, MASAHIRO;KITAKURA, KAZUYUKI;MUTA, SHIGEKI;YOSHIKAWA, TAKAO
分类号 B32B7/12;C08L79/08;C09J5/00;C09J7/02;C09J133/06;H01L21/58;H01L23/373;(IPC1-7):C09J7/02;H05K7/20;C09J5/02;C08F20/18 主分类号 B32B7/12
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