Capacitor structures, DRAM cell structures, methods of forming capacitors, methods of forming DRAM cells, and integrated circuits incorporating capacitor structures and DRAM cell structures

摘要

Semiconductor capacitor constructions, DRAM cell constructions, methods of forming semiconductor capacitor constructions, methods of forming DRAM cell constructions, and integrated circuits incorporating capacitor structures and DRAM cell structures are encompassed by the invention. The invention includes a method comprising: a) forming an opening within an insulative layer and over a node location; b) forming a spacer within the opening to narrow the opening, the spacer having inner and outer surfaces, the inner surface forming a periphery of the narrowed opening; c) removing a portion of the insulative layer from proximate the outer surface to expose at least a portion of the outer surface; d) forming a storage node layer in electrical connection with the node location, extending along the spacer inner surface, and extending along the exposed spacer outer surface; and e) forming a dielectric layer and a cell plate layer operatively proximate the storage node layer. The invention also includes a construction comprising: a) an opening extending through an insulative layer to a node location; b) a conductive spacer within the opening and narrowing at least a portion of the opening; the conductive spacer having inner and outer surfaces; c) a storage node layer in connecting with the node location and extending along both of the inner and outer surfaces of the conductive spacer, the storage node layer and conductive spacer together forming a capacitor storage node; and d) a dielectric layer and a cell plate layer operatively proximate the storage node.