| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a film excellent in cutting properties and generating neither burrs nor scraps when cut off by forming as an adhesive layer a layer comprising a polyamideimide resin having copolymerized therewith a dimer acid and having a logarithmic viscosity of a specific value or higher on one surface or both surfaces of a support film. SOLUTION: There is provided an adhesive film comprising a support film 5-200μm in thickness and a layer, formed as an adhesive layer on one surface or both surfaces thereof, comprising a polyamideimide resin having a logarithmic viscosity of at least 0.1 dl/g and obtained by copolymerizing therewith at least 1 wt.% of a dimer acid, and the thickness of the adhesive layer is preferably 1-75μm. This adhesive film is cut into a prescribed size and sandwiched between a lead frame and a semiconductor element and is contact-bonded at 150-200 deg.C and 5-100 kg/cm2, and subsequently the lead frame and the semiconductor element are joined by gold wires or the like and sealed with an epoxy resin or the like to give a semiconductor device. The polyamideimide resin is prepared by copolymerizing trimellitic anhydride with a diamine or a diisocyanate, and a dimer acid in a solvent at 50-220 deg.C.</p> |
