Semiconductor device and equipment for manufacturing the same as well as method of fabricating the same

摘要

A bonding tool for bonding an inner lead to an electrode pad of a semiconductor chip, wherein the bonding tool has a head surface which is rectangular. The rectangular head surface has a long side that is perpendicular to a longitudinal direction of the inner lead and wider than a width of the inner lead, and a short side that is narrower than an opening in a passivation film.