发明名称 STRUCTURE OF FILM MOLD IN DEEP-DRAW VACUUM PACKAGING APPARATUS
摘要 PROBLEM TO BE SOLVED: To reduce the reduction ratio of the wall thickness of the bottom corner R-part of an article housing recessed part by gradually increasing the inner dimension of the molding recessed part of the film mold provided in a molding box from the opening end of the molding recessed part to the bottom part thereof in order to form the article housing recessed part to a lower film in a deep-draw vacuum packaging apparatus. SOLUTION: A molding box 13 is allowed to communicate with a vacuum source through the through-hole 20 provided to the lower corner part of the molding box 13 and a forming stand 22 is placed on the receiving stand of the inner bottom surface of the molding box 13. The forming stand 22 can be divided into two parts and the side walls 24a four in total of the formed molding recessed parts 23 having a circular shape on a plan view are gradually expanded downward to be connected to the horizontal bottom parts of the recessed parts 23 through bottom corner R-parts. A lower film is heated and softened by a molding bridge 10 and, thereafter, the molding box 13 communicates with the vacuum source and the molding recessed parts 23 are reduced in pressure through the small hole of the receiving stand or forming stand 22 to suck the film downward. By this constitution, the wall thickness reducing ratio of the bottom corner R-part of an article housing recessed part can be reduced.
申请公布号 JP2001009901(A) 申请公布日期 2001.01.16
申请号 JP19990180687 申请日期 1999.06.25
申请人 OMORI MACH CO LTD 发明人 OMORI SHOZO
分类号 B29C51/30;B29C51/08;B29C51/10;B29L22/00;(IPC1-7):B29C51/30 主分类号 B29C51/30
代理机构 代理人
主权项
地址