| 摘要 |
A semiconductor device including a die pattern for mounting a semiconductor chip thereon using an adhesive, and connection electrodes connected with each electrode of the semiconductor chip by bonding wires, wherein the die pattern and connection electrodes are provided on one surface of the circuit board, a wiring pattern electrically connected with the die pattern or the connection electrodes by way of through-holes, and a plurality of solder bumps electrically connected with the wiring pattern, wherein the wiring pattern facing the semiconductor chip is formed on substantially an entire surface of a predetermined region which is larger than the outer dimensions of the semiconductor chip and extends to the entire periphery of the semiconductor chip.
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