| 摘要 |
PROBLEM TO BE SOLVED: To provide a new adhesive composition which does not cause any problem concerning the maintenance of heat resistance as in the case of conventional hot-melt adhesives, nor any problem concerning irritating odors generated by residual monomers, a low maintenance of adhesion, etc., as in the case of acrylic resin adhesives. SOLUTION: This composition comprises an epoxy compound (A) which has a weight average molecular weight of 6,000 or smaller and has an epoxy group within the molecule, a compound (B) which has a weight average molecular weight of 6,000 or smaller and has a functional group reactive with epoxy groups, a cationic curing catalyst (C) and, if required, an adhesion-imparting agent (D). The proportion of the components in the composition are from 20 to 70 wt.% epoxy compound (A), from 5 to 60 wt.% compound (B), from 0 to 60 wt.% adhesion-imparting agent (D) (provided that these three components totals up to 100 wt.%), and from 0.01 to 10 pts.wt. cationic curing catalyst (C) against 100 pts.wt. total of the above three components.
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