发明名称 HEAT-RESISTANT RESIN COMPOSITION, COATING MATERIAL AND ENAMELED WIRE
摘要 PROBLEM TO BE SOLVED: To obtain a heat-resistant resin composition having excellent abrasion resistance and flexibility and useful as a coating film component of a coating material, a varnish for enameled wire, etc., by including a polyamide-imide resin and a compound having mercapto group. SOLUTION: This composition contains (A) a polyamide-imide resin (preferably a polyamide-imide resin having a number-average molecular weight of 10,000-50,000) and (B) a compound having mercapto group (preferably 2-amino-5- mercapto-1,3,4-thiadiazole). The composition preferably contains 0.01-20 pts.wt. of the component B based on 100 pts.wt. of the component A. A coating material can be produced e.g. by adding 7.0 pts.wt. of N-methyl-2-pyrrolidone solution of 2-amino-5-mercapto-1,3,4-thiadiazole to 100 pts.wt. of a solution of a polyamide-imide resin having a number-average molecular weight of 21,200 and composed of 4,4'-diphenylmethane diisocyanate, trimellitic anhydride and N-methyl-2-pyrrolidone.
申请公布号 JP2001011312(A) 申请公布日期 2001.01.16
申请号 JP19990185243 申请日期 1999.06.30
申请人 HITACHI CHEM CO LTD 发明人 OKAWARA TOSHIICHI;OSADA YUICHI;YOTSUYA SEIICHI
分类号 C08L79/08;C08K5/46;C09D5/25;C09D179/08;(IPC1-7):C08L79/08 主分类号 C08L79/08
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