发明名称 Heat-dissipating device
摘要 A heat-dissipating device is adapted for dissipating heat inside an equipment housing which includes a housing part having upright first and second side walls and a bottom wall. The first and second side walls extend transverse to each other such that the first and second side walls and the bottom wall cooperate to form a corner portion of the housing part. The heat-dissipating device includes a remote heat-dissipating unit adapted to be disposed in the equipment housing and having a heat transfer plate, a heat exchanger pipe connected to the heat transfer plate, and a heat sink coupled to the heat exchanger pipe, and a fan unit adapted to be disposed in the corner portion. The fan unit includes a fan housing having a fan disposed therein, a fastening seat member adapted to be fastened removably on the first side wall and the bottom wall and retaining the fan housing in the housing part, and a supporting member having an anchoring frame part connected to the fan housing, a reinforcing frame part extending from the anchoring frame part, and a fastening frame part extending transversely from the reinforcing frame part and spaced apart from the fan housing to form a sink mounting space therebetween. The heat sink is disposed in the sink mounting space and is fastened removably to the fastening frame part.
申请公布号 US6175496(B1) 申请公布日期 2001.01.16
申请号 US19990455505 申请日期 1999.12.06
申请人 COMPAL ELECTRONICS, INC. 发明人 LIU JEN-HAO;CHANG HSIANG;CHEN HSIANG-WEI;LIN SHIH-WEI
分类号 H05K7/20;(IPC1-7):H05H7/20 主分类号 H05K7/20
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