发明名称 Method for depositing atomized materials onto a substrate utilizing light exposure for heating
摘要 The present invention is generally directed to a process and a system for forming photoresist coatings on a semiconductor wafer. In particular, according to the present invention, a solution containing a photoresist material is atomized in a reaction vessel and directed towards a semiconductor wafer. The semiconductor wafer can be preheated. The atomized liquid is heated, such as by being exposed to light energy which causes the photoresist material to form a coating on the substrate.
申请公布号 US6174651(B1) 申请公布日期 2001.01.16
申请号 US19990229872 申请日期 1999.01.14
申请人 STEAG RTP SYSTEMS, INC. 发明人 THAKUR RANDHIR P. S.
分类号 B05D1/02;B05D1/40;B05D3/06;G03F7/16;H01L21/027;(IPC1-7):G03F7/00;G03F7/38 主分类号 B05D1/02
代理机构 代理人
主权项
地址