发明名称 SOLDER PELLET
摘要 PROBLEM TO BE SOLVED: To firmly fix parts without a scrubbing operation. SOLUTION: This solder pellet 20 has such a shape that the bottom face side is formed flat and the top face side is protruded upwards by an inclined face. When a part 2 is lowered from above while the solder pellet 20 is put on a substrate 1 and heated from the bottom face side of the substrate 1, the pellet 20 is brought into point or line contact with a bottom face 2a of the part 2. Thereby, a force in a direction for displacing an oxide film 21 on the surface can be generated at the contact portion, and the part 2 and the substrate 1 can be firmly fixed without remaining the oxide film therebetween.
申请公布号 JP2001009586(A) 申请公布日期 2001.01.16
申请号 JP19990185504 申请日期 1999.06.30
申请人 ANRITSU CORP 发明人 ONO JUN;HANADA KANAME
分类号 B23K35/14;(IPC1-7):B23K35/14 主分类号 B23K35/14
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