| 摘要 |
PROBLEM TO BE SOLVED: To obtain a laminated element of high space factor by applying a low viscosity binder to a die side face of a bandlike thin plate single plate punching position for laminating/jointing and, performing a punching processing after immediately moving it onto the die. SOLUTION: A band-like thin plate 11 is intermittently moved between a punch 4 and a die 5 and, punch block 1 advancing operation and a binder discharging operation from a nozzle 9 of a binder applying part 3 are controlled to be synchronized along with a stop timing of the intermittent movement. When the punch block 1 advances, the bandlike thin plate 11 is pressed upon the die 5 and abuts against the binder applying part 3. At this time, the punch 4 descends on the die 5 for punching out an iron core single plate 6 from the bandlike thin plate 11. The iron core single plate 6 is inserted into a punch hole 5a formed on the die 5 so as to be laminated. Also, on the binder applying part 3, a binder 7 is discharged from the nozzle 9 so as to apply the binder 7 to a bottom face of the band-like thin plate 11.
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