发明名称 Stable metallization for electronic and electromechanical devices
摘要 Described are various improved methods of forming electronic devices, electro-mechanical devices, force-sensing devices, and accelerometers. Also described are various improved electronic devices, electro-mechanical devices, force-sensing devices, and accelerometers. The device comprises a plurality of vibrating beams joined with a support portion and configured for movement relative to the support portion. A layer of electrically conductive material is disposed over at least some of the surface of the moveable portion and support portion, the layer comprising an inert or a noble material having a Young's modulus which is greater than that of elemental gold. Alternatively, the layer may comprise an inert material having a coefficient of expansion which is less than that of elemental gold.
申请公布号 US6173612(B1) 申请公布日期 2001.01.16
申请号 US19980187288 申请日期 1998.11.05
申请人 ALLIEDSIGNAL INC. 发明人 GOLECKI ILAN;EAGAN MARGARET
分类号 G01L1/18;G01P15/08;G01P15/097;G01P15/10;(IPC1-7):G01P15/10 主分类号 G01L1/18
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