发明名称 COMPOSITION FOR CERAMIC SUBSTRATE AND CERAMIC CIRCUIT PART
摘要 PROBLEM TO BE SOLVED: To obtain a composition for a ceramic substrate sinterable at a low temperature of <=1,000 deg.C and capable of simultaneously sintering an electric conductor circuit consisting essentially of a low-resistance metal such as an Ag- or a Cu-based metal and providing a dense sintered compact. SOLUTION: This composition for a ceramic substrate comprises 25-34 wt.% of a glass powder and 66-75 wt.% of a ceramic powder, respectively. The ceramic powder comprises at least two kinds of particles of fine particles and coarse particles having mutually different particle diameters and the average particle diameter of both the fine and the coarse particles in all is <1 &mu;m. The average particle diameter of the glass powder is <1 &mu;m. A dense sintered compact good in dispersibility of the ceramic in the glass can be obtained at a baking temperature of <=1,000 deg.C by using the composition.
申请公布号 JP2001010858(A) 申请公布日期 2001.01.16
申请号 JP19990175115 申请日期 1999.06.22
申请人 MURATA MFG CO LTD 发明人 SHIRATORI AKIRA;KISHIDA KAZUO;YOKOKURA OSAMU
分类号 H01G4/12;C03C3/062;C03C3/064;C04B35/111;H01G4/30;H01G4/40 主分类号 H01G4/12
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