发明名称 PRODUCTION OF ELECTROLYTIC COPPER FOIL
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing electrolytic copper foil by which the electrolytic copper foil which is thin, has large tensile strength and high rigidity and thereby is excellent in handling easiness, both surfaces of which are smooth and have equal surface roughness and which is excellent in extension percentage, can be manufactured by using an electrolytic solution obtained from inexpensive copper scrap. SOLUTION: Copper scrap is subjected to sintering treatment and then to pickling treatment. Obtained processed copper is dissolved in a sulfuric acid aqueous solution to produce an electrolytic solution. Obtained electrolytic solution is subjected to electrolysis to deposit copper. The sintering treatment is desirably executed by blowing hot air of 500 to 800 deg.C to the copper scrap for 1 to 30 minutes and the pickling treatment is desirably executed by oscillating the sintering-treated copper scrap in the sulfuric acid aqueous solution of 0.1 to 2.0 mol/l.</p>
申请公布号 JP2001011684(A) 申请公布日期 2001.01.16
申请号 JP19990183528 申请日期 1999.06.29
申请人 NIPPON DENKAI KK 发明人 HARIGAYA KOICHI;NOGUCHI HIDEO;KOBAYASHI KATSUMI;NARISHIMA RYOICHI;ASO KAZUYOSHI
分类号 C22B7/00;C22B15/00;C25C1/12;C25D1/04;C25D3/38;(IPC1-7):C25D1/04 主分类号 C22B7/00
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