| 摘要 |
PROBLEM TO BE SOLVED: To remove the unnecessary solder layer or solder oxide layer bonded and deposited on the surface of the contact part of an IC socket without detaching the IC socket from a printed wiring board. SOLUTION: When the unnecessary solder layer or solder oxide layer bonded and deposited on the surface of the contact part 33 of an IC socket 31 is removed, an electrolyte gel is placed on the surface of the contact part 33 and a DC power supply is connected to the electrolyte gel so that the electrolyte gel becomes an anode and the contact part becomes a cathode to apply a current thereto and the solder layer or solder oxide layer is electrolyzed to be taken in the electrolyte gel to clean the surface of the contact part.
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