发明名称 Dynamic random access memory cell having an improved fin-structured storage electrode and method of fabricating the same
摘要 A capacitor includes a semiconductor substrate; an inter-layer insulator formed over the silicon substrate; at least two interconnections formed within the inter-layer insulator, the two interconnections being distanced at a pitch in a lateral direction; a fin-structured storage electrode comprising a vertically extending column portion and a plurality of fins, each of which laterally and radially extends from the vertically extending column portion, the fins being spaced in a vertical direction and the vertically extending column portion extending through the inter-layer insulator to a surface of the semiconductor substrate and also extending upwardly from a surface of the inter-layer insulator, wherein the vertically extending column portion is smaller in diameter within the inter-layer insulator and larger in diameter over the inter-layer insulator; a capacitive insulation film formed on a surface of the fin-structured storage electrode; and an opposite electrode formed on the capacitive insulation film.
申请公布号 US6174768(B1) 申请公布日期 2001.01.16
申请号 US19980177610 申请日期 1998.10.23
申请人 NEC CORPORATION 发明人 TAKAISHI YOSHIHIRO
分类号 H01L27/04;H01L21/02;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/824 主分类号 H01L27/04
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