发明名称 RESIN COMPOSITION IMPROVED IN BONDABILITY BY HOT-PLATE FUSION
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition which does not leave behind a carbonized resin on a hot plate, does not form thin resin threads, and thus exhibits an improved bondability by hot-plate fusion by compounding a polyester resin, a polycarbonate resin, a core-shell polymer, and polytetrafluoroethylene having a specified number average molecular weight. SOLUTION: An example of the polyester resin (A) is one prepared by reacting a dicarboxylic acid with a diol. An example of the polycarbonate resin (B) is an aromatic polycarbonate resin. The core-shell polymer (C) is prepared by the graft polymerization of at least one shell-forming monomer onto rubberlike cores, an example being one prepared by grafing polystyrene or the like onto cores comprising an acrylate rubber. The polytetrafluoroethylene (D) has a number average molecular weight of 30,000 or higher. The compounding ratio (wt.%) of A:B:C:D is (98-1):(1-98):(0.5-18):(0.01-4).
申请公布号 JP2001011293(A) 申请公布日期 2001.01.16
申请号 JP19990189435 申请日期 1999.07.02
申请人 GE PLASTICS JAPAN LTD 发明人 OSHIMA AKIFUMI;HIRATA TERUMASA
分类号 C08L67/00;B29C65/00;B29C65/20;C08L27/18;C08L51/04;C08L67/02;C08L69/00 主分类号 C08L67/00
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