发明名称 CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition capable of exhibiting excellent storage stability and further exhibiting good curability at normal temperature without deteriorating curing characteristics when a curing agent is added thereto by making phenylphosphonic acids and an N-oxyl compound exist together in a resin composition. SOLUTION: This composition comprises (A) a radically curable resin (preferably an unsaturated polyester resin, a vinyl ester resin or the like) and (B) a metal compound having redox actions (e.g. a metal salt of an aliphatic carboxylic acid) and consists essentially of (C) phenylphosphonic acids (preferably phenylphosphonic acid, a phenylphosphonic acid ester or the like) and (D) an N-oxyl compound (e.g. 4-hydroxy-2,2,6,6-tetramethylpiperidin-1-oxyl). Furthermore, the contents of the components based on the whole resin composition are preferably 10-500 ppm of the component C expressed in terms of weight ratio and preferably 10-1,000 ppm of the component D expressed in terms of the weight ratio.
申请公布号 JP2001011328(A) 申请公布日期 2001.01.16
申请号 JP19990189159 申请日期 1999.07.02
申请人 NIPPON SHOKUBAI CO LTD 发明人 OZAKI YUKIISA;IWAKI TSUGUSHIGE
分类号 C08K5/32;C08F283/01;C08F290/00;C08F299/00;C08K5/5333;C08L67/06;C08L101/00;C08L101/16;(IPC1-7):C08L101/16;C08K5/533 主分类号 C08K5/32
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