发明名称 CURING COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a curing composition excellent in heat resistance, mechanical characteristics, electrical characteristics, weather resistance and storage stability by including an epoxy compound, a (meth)acryloyl compound and an amine compound. SOLUTION: This composition is prepared by including (A) an epoxy compound, (B) a (meth)acryloyl compound [e.g. diethylene glycol di(meth)acrylate] and (C) a catalytic quantity of an amine compound (e.g. 1,8- diazabicyclo[5.4.0]undecan-7-ene). The quantity ratio of the ingredient A to the ingredient B is set preferably in such a way that 0.6 to 1.7 equivalents of acryloyl group in the ingredient B based on one equivalent of epoxy group in the ingredient A is included. The ingredient C preferably has a basicity value of <=8 and its catalytic quantity preferably is 0.1-50 pts.wt. based on 100 pts.wt. of the ingredient A.
申请公布号 JP2001011162(A) 申请公布日期 2001.01.16
申请号 JP19990186962 申请日期 1999.06.30
申请人 TOAGOSEI CO LTD 发明人 WASHIMI AKIRA;KIMURA KAORU;TAKEI MASAO;HIRAOKA HIDEKI
分类号 C08G59/68;(IPC1-7):C08G59/68 主分类号 C08G59/68
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