| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition having excellent flame retardance by a halogen-free prescription and excellent in heat resistance and moisture resistance, and useful for uses in laminate part materials, semiconductor sealing materials, or the like, by including a specific polyfunctional epoxy resin, a curing agent and a phosphorus atom-containing compound. SOLUTION: This epoxy resin composition consists essentially of (A) a polyfunctional epoxy resin having (a) a structure obtained by reacting (i) a bisphenol type epoxy resin with (ii) a novolak resin or (b) a structure obtained by reacting the component (i) with (iii) a novolak type epoxy resin and (iv) bisphenols, (B) a curing agent and (C) a phosphorus-containing compound. The component A has preferably 200-400 epoxy equivalent. The component B is preferably a compound having phenol skeleton and triazine skeleton. The component C is preferably used in an amount of 5-50 wt.% based on solid content in the composition.
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