| 摘要 |
PROBLEM TO BE SOLVED: To provide a production method of an ink-jet printer head, capable of producing an appropriate product at a good yield by preventing a problem of cracking of a substrate. SOLUTION: In head chips 35 with the same configuration on a silicon wafer 52, in the exposure of a driving circuit, first, head chips 35 in odd-numbered rows 56 in the arrangement direction orthogonal to an orientation flat 55 are exposed. Next, with the reticle of the silicon wafer 52 rotated by 180 degrees, head chips 35 in even-numbered rows 57 are exposed so as to form driving circuits zigzag in the head chip longitudinal direction for each head chip 35. Thereafter, a heat generation part, a common electrode, an individual wiring electrode, a partition wall, a common ink supply groove 43, an ink receipt and supply hole 44, an ink ejection nozzle, or the like are formed by a processing step same as the conventional method, using a proximity type exposing device and a photomask with patterns arranged zigzag. Accordingly, the common ink supply grooves 43 as a narrow groove are not aligned straightly, thus the silicon wafer 52 hardly cracks in the later step.
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