发明名称 FORMATION OF THIN FILM AND THIN FILM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thin film forming method for forming a uniform thin film with high reproducibility and high efficiency to a substrate of a large area succeedingly carried to a thin film forming device and to provide the thin film forming device. SOLUTION: In a thin film forming method in which a raw material soln. 2 is atomized and is sprayed on a substrate to form a thin film, while the amt. of the atomized raw material soln. is monitored, the frequency of an ultrasonic vibrator transducer 3 is controlled, and the raw material soln. to be sprayed on the substrate is fixedly retained. Moreover, at the time of the film formation, it is executed while the substrate is rotated. Moreover, only in the case the substrate is carried and arranged at a prescribed film forming position, the atomized raw material soln. is sprayed on the substrate.
申请公布号 JP2001011653(A) 申请公布日期 2001.01.16
申请号 JP19990189018 申请日期 1999.07.02
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHIKAWA KAZUHIRO;TSUTSUI YUJI;NAKA HIROYUKI
分类号 H01J9/02;B05B15/00;C03C17/25;C23C26/00;H01J11/22;H01J11/34;H01J11/38;H01J11/40;(IPC1-7):C23C26/00;H01J11/02 主分类号 H01J9/02
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