发明名称 POLYAMIDE RESIN COMPOSITION FOR BLOW MOLDED ARTICLE AND BLOW MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition for blow molding having balanced and excellent dimensional stability, chemical resistance, gas barrierness, low-temperature toughness, etc. SOLUTION: This blow-molding polyamide resin composition contains (a) 100 pts.wt. of a polyamide resin and (b) 0.5-150 pts.wt. of a liquid crystal resin. The number-average dispersed particle diameter of the liquid crystal resin is 0.05-1.5μm and not less than 60% of the particles are present within the range of the (number-average particle diameter)±(average particle diameter)×0.3. The composition is preferably further incorporated with 1-250 pts.wt. of an electrically conductive filler and/or electrically conductive polymer based on 100 pts.wt. of the sum of the polyamide resin and the liquid crystal resin.
申请公布号 JP2001011306(A) 申请公布日期 2001.01.16
申请号 JP19990224503 申请日期 1999.08.06
申请人 TORAY IND INC 发明人 UMETSU HIDEYUKI;TACHIKAWA KOJI;MAKABE YOSHIKI
分类号 C08J5/00;B29C47/06;C08K3/00;C08L67/03;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08J5/00
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