| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composite part improved in adhesion of the constituent plastic to the constituent plastic by hot-stamping a metal foil at least either surface of which has microporous structures formed by surface treatment on the surface of a thermoplastic resin molding. SOLUTION: At least either surface of a metal foil having a thickness of at most 0.1 mm is surface-treated by an electroless copper plating process to obtain a metal foil on which microporous structures having a diameter of a single pore of 0.01-10μm are uniformly and densely formed. This foil is hot- stamped on the surface of a thermoplastic resin molding. It is desirable that the temperature of the mold during hot stamping is equal to or higher than the melting point of softening point of the thermoplastic resin used in order to ensure sufficient interfacial adhesion between the resin and the foil. An example of the process for forming a desired circuit pattern on the surface of the molding consists of hot-stamping a metal foil previously trimmed into a specified circuit pattern on the surface.
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