| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent of a short circuit of adjacent solders by a method wherein a cutout is formed on a ceramic base body at a portion from the top face to the edge face positioned at the outside of a solder bonding section to be connected to an FPC, thereby enlarging a gap between a top face of a head substrate and the lower face of the FPC so that even when a redundant solder extends beyond a predetermined region, the solder is not spread in the arrangement direction of terminals but in the vertical direction. SOLUTION: A thermal head consists of a rectangular head substrate 1 wherein a plurality of heating elements and circuit conductors 4 are formed on a top face of a ceramic substrate 2 and an FPC 6 wherein a part thereof is superposed on the top face of the head substrate 1 along the edge of one side and circuit conductors 7 are bonded to the circuit conductors 4 by soldering (solder 9) at the superposed portion. A cutout 2a is formed on the ceramic substrate 2 at a portion from the top face positioned outside the solder bonding section 9 to the edge face.
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