发明名称 Spacers to block deep junction implants and silicide formation in integrated circuits
摘要 An efficient method of forming deep junction implants in one region without affecting the implant of a second region of an integrated circuit is provided. This is achieved by forming spacers of deep junction devices with the same material used to fill the gaps of shallow junction devices.
申请公布号 US6174756(B1) 申请公布日期 2001.01.16
申请号 US19970940236 申请日期 1997.09.30
申请人 SIEMENS AKTIENGESELLSCHAFT;IBM 发明人 GAMBINO JEFFREY P.;ALSMEIER JOHANN;BRONNER GARY
分类号 H01L27/108;H01L21/76;H01L21/822;H01L21/8234;H01L21/8242;H01L27/04;(IPC1-7):H01L21/00;H01L21/84 主分类号 H01L27/108
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