| 摘要 |
In accordance with the invention, a plurality of high thermal conductivity bodies are bonded to relatively hot spots of a component-populated substrate surface to provide thermal conduction from the surface to an overlying thermal plane. The high conductivity bodies can be configured for pick-and-place application and self-aligned in solder bonding. Receiving solder pads on the substrate facilitate low thermal resistance solder bonding and self-alignment. In a preferred embodiment the bodies are rectangular parallelpipeds with bifurcated bonding surfaces.
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