发明名称 THERMOSETTING RESIN COMPOSITION FOR BUILD-UP CONSTRUCTION METHOD, INSULATION MATERIAL FOR BUILD-UP CONSTRUCTION METHOD, AND BUILD-UP PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition which gives a cured item having very low water absorption properties without detriment to its high heat resistance and low permittivity by incorporating a thermosetting resin and a liquid crystal polyester into the same. SOLUTION: Examples of the thermosetting resin are an epoxy resin, a cyanate resin, a phenol resin, and a melamine resin, an epoxy resin being preferable in terms of reactivity and handleability. A liquid crystal polyester which forms an anisotropic melt at 400 deg.C or lower is preferable, an example being one prepared from the combination of an aromatic dicarboxylic acid, an aromatic diol, and an aromatic hydroxycarboxylic acid. Preferably, a liquid crystal polyester in the form of a powder is mixed with other ingredients, and the average particle size of the powder is preferably 0.1-100μm. The compounding ratio by wt. of the thermosetting resin to the liquid crystal polyester is 100/(5-50). The thermosetting resin may contain a curing agent and a cure catalyst as required.
申请公布号 JP2001011295(A) 申请公布日期 2001.01.16
申请号 JP19990188975 申请日期 1999.07.02
申请人 SUMITOMO CHEM CO LTD 发明人 OKAMOTO SATOSHI;NAKAJIMA NOBUYUKI
分类号 C08L67/03;C08L63/00;C08L101/00;C08L101/16;(IPC1-7):C08L67/03 主分类号 C08L67/03
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