LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a liquid epoxy resin composition which gives a cured molded item having a low internal stress and can prevent the occurrence of warpage of a sealed substrate by compounding a specified amount of a naphthalene- backbone or biphenyl-backbone epoxy resin with a silicone component comprising a modified silicone oil and a silicone powder. SOLUTION: The naphthalene-backbone or biphenyl-backbone epoxy resin is compound in an amount of 5-80 wt.% of the total amount of epoxy resin components. The silicone powder is a powder of a silcone rubber or a silicone resin. The silicone component is compounded in an amount of 15-60 wt.% of the total amount of resin components. A cured molded item obtained from the composition has a flexural modulus of 0.5-5 GPa, a flexural strength of 20-40 MPa, a glass transition point of 120-200 deg.C, and a coefficient of linear thermal expansion of 1.3×10-5-1.8×10-5.