| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject resin sealing press apparatus reduced in cost, capable of being narrowed in its installation space and capable of being enhanced in productivity. SOLUTION: In a resin sealing press apparatus wherein either one of upper and lower molds freely advances to and retreats from the other one of them to clamp a semiconductor device to be sealed with a resin by both molds and a molten resin is injected in the cavity formed between the clamped upper and lower molds to be shaped, a plurality of resin sealing presses 1, 9 are provided and the freely advancing and retreating molds 2, 22 among the upper molds 6, 62 and lower molds 2, 22 of the resin sealing presses 1, 9 are connected to the same drive device 10 so as to provide a phase difference in the mold clamping timing due to the upper molds 6, 62 and lower molds 2, 22 of the resin sealing presses 1, 9.
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