发明名称 FORMATION OF METALLIC FILM ON RESIN SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To form a metallic film on a resin substrate with good adhesion by carrying photocatalyst particles which degrade the resin of the resin substrate on the surface of the resin substrate, irradiating the photocatalyst particles with UV, removing these by washing in water under ultrasonic vibration and coating the resin substrate with metal by sputtering, vacuum deposition or electroless plating. SOLUTION: The resin of the resin substrate is degraded by the action of the photocatalyst to roughen the surface of the substrate. Then the washing in water under ultrasonic vibration is carried out, the photocatalyst particles remaining on the surface of the substrate are removed by the cavitation action of ultrasonic waves. The photocatalyst particles are preferably dispersed in a water-soluble medium, applied and carried on the surface of the resin substrate. The photocatalyst is preferably anatase type titanium dioxide and the irradiation with UV is preferably carried out by exposure to plasma. The resin of the resin substrate may be acrylic resin, polyethylene or epoxy resin.
申请公布号 JP2001011644(A) 申请公布日期 2001.01.16
申请号 JP19990182621 申请日期 1999.06.29
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 YAMADA SHUGO
分类号 H05K3/38;C23C14/02;C23C18/20;(IPC1-7):C23C18/20 主分类号 H05K3/38
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