发明名称 |
Printed circuit board and method for producing the same |
摘要 |
A printed circuit board includes insulating layers formed by impregnating a base material with a resin and a metal foil pattern formed on a desired layer of the insulating layers. Ions for forming a hardly soluble metal salt by combining with metal ions free from a portion of the board or a sulfur-containing compound for reacting with the metal ion are present in the insulating layer or on a surface of the metal foil pattern. Furthermore, a method for producing the printed circuit board includes any one of the steps of adding the ions or the sulfur-containing compound to the resin varnish, impregnating a base material with the solution of the ions or the sulfur-containing compound, or applying the solution onto the surface of the metal foil pattern, in order to allow the ions or the sulfur-containing compound to exist in the printed circuit board.
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申请公布号 |
US6174589(B1) |
申请公布日期 |
2001.01.16 |
申请号 |
US19980159376 |
申请日期 |
1998.09.23 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
KAWAKITA YOSHIHIRO;NAKATANI SEIICHI;TANAHASHI MASAKAZU |
分类号 |
H05K1/03;(IPC1-7):B32B3/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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