发明名称 |
CONNECTION STRUCTURE OF THERMOCOUPLE |
摘要 |
PURPOSE: A connection structure of a thermocouple is provided to improve productivity of a semiconductor device by detecting and controlling a temperature of a diffusion furnace, correctly. CONSTITUTION: A multitude of spike thermocouple(11) is installed at a heat chamber in order to detect a temperature of the heat chamber. A multitude of profile thermocouple(15) is installed in the heat chamber in order to measure a real temperature of the heat chamber. A multitude of spike thermocouple(11a) is installed in a source chamber in order to detect the temperature. The spike thermocouples(11) are connected with a thermal control device through a thermal compensation line(12) and a spike junction board(13). The profile thermocouples(15) is connected with the thermo control device through a thermal compensation line(12a) and a profile junction board(16). The spike thermocouples(11a) are connected with the thermal control device through a thermal compensation line(12b) and a source junction board(17).
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申请公布号 |
KR100273205(B1) |
申请公布日期 |
2001.01.15 |
申请号 |
KR19960058662 |
申请日期 |
1996.11.28 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO., LTD. |
发明人 |
JUNG, GYEONG CHEOL;JUNG, JAE BONG |
分类号 |
(IPC1-7):H01L21/20 |
主分类号 |
(IPC1-7):H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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