发明名称 CONNECTION STRUCTURE OF THERMOCOUPLE
摘要 PURPOSE: A connection structure of a thermocouple is provided to improve productivity of a semiconductor device by detecting and controlling a temperature of a diffusion furnace, correctly. CONSTITUTION: A multitude of spike thermocouple(11) is installed at a heat chamber in order to detect a temperature of the heat chamber. A multitude of profile thermocouple(15) is installed in the heat chamber in order to measure a real temperature of the heat chamber. A multitude of spike thermocouple(11a) is installed in a source chamber in order to detect the temperature. The spike thermocouples(11) are connected with a thermal control device through a thermal compensation line(12) and a spike junction board(13). The profile thermocouples(15) is connected with the thermo control device through a thermal compensation line(12a) and a profile junction board(16). The spike thermocouples(11a) are connected with the thermal control device through a thermal compensation line(12b) and a source junction board(17).
申请公布号 KR100273205(B1) 申请公布日期 2001.01.15
申请号 KR19960058662 申请日期 1996.11.28
申请人 HYUNDAI MICRO ELECTRONICS CO., LTD. 发明人 JUNG, GYEONG CHEOL;JUNG, JAE BONG
分类号 (IPC1-7):H01L21/20 主分类号 (IPC1-7):H01L21/20
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