BUMPING DEVICE OF SOLDER BALL FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A bumping device of a solder ball for manufacturing a semiconductor package is provided to increase productivity of solder ball by bumping all kinds of solder balls with their diameters under certain range using one tool upon bumping the same to back face of the semiconductor package. CONSTITUTION: A bumping device of a solder ball for manufacturing a semiconductor package comprises a flux dotting unit(100), an object loading unit(200), a solder ball feeding unit(300) and a solder ball bumping unit(400). The dotting unit dots a solder ball land on a semiconductor package object with a flux and carries the object to the next stage. The carried object is transferred by object loading unit. The feeding unit seats the solder ball in a loading recess on a seating tool and transfers the tool and a thin plate covered on the tool to the next stage, and slides the thin plate out of the tool. The bumping unit grips the transferred object and positions a bumping tool under the gripped object, and then bonds the solder ball to the solder ball land.