SEMICONDUCTOR COB MODULE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor COB(Chip On Board) module and a method for fabricating the same are provided to improve an electric characteristic of a COB by minimizing a length of signal line between a semiconductor chip and a printed circuit board. CONSTITUTION: A multitude of molding hole(11b) is formed on a printed circuit board(11) in order to expose a circuit line(11a). A semiconductor chip(12) is adhered to one side of the printed circuit board(11) in order to combine the circuit line(11a) with a pad. A sealing portion(13) is inserted into the molding hole(11b) in order to protect the circuit line(11a) from an outside. An elastomer(14) is inserted between the printed circuit board(11) and the semiconductor chip(12) in order to absorb the amount of thermal variation. A chip loading portion is formed on the printed circuit board(11) in order to prevent protuberance of the elastomer(14).