发明名称 METHOD FOR FORMING ELECTRODE AND BARRIER RIB OF PLASMA DISPLAY PANEL USING ELECTROPLATING
摘要 PURPOSE: A method for fabricating an electrode and a barrier rib of a plasma display panel using electroplating is provided to solve a misaligning between the electrode and the barrier rib, and to reduce a production time. CONSTITUTION: A method for fabricating an electrode and a barrier rib of a plasma display panel using electroplating comprises the steps of: forming a copper seed layer on a front side of a transparency panel; forming the first insulation film pattern on the seed layer to expose the electrode and the barrier rib; forming the electrode and a first barrier rib layer using electroplating by connecting the seed layer to a cathode, and a metal plate to an anode; removing the first insulation film pattern and forming the second insulation film pattern covering the electrode; forming the second barrier rib layer on the first barrier rib using electroplating by connecting the seed layer to the cathode, and the metal plate to the anode; forming an oxidation film on the surfaces of the first and the second barrier rib layers using electroplating by connecting the seed layer to the anode, and the oxidation plate to the cathode; and removing the seed layer remaining in an area other than the electrode and the barrier rib.
申请公布号 KR20010004318(A) 申请公布日期 2001.01.15
申请号 KR19990024942 申请日期 1999.06.28
申请人 HYNIX SEMICONDUCTOR INC. 发明人 YOON, DAE JUNG
分类号 H01J9/02;H01J9/24;H01J11/22;H01J11/36;(IPC1-7):H01J17/49 主分类号 H01J9/02
代理机构 代理人
主权项
地址