| 摘要 |
PURPOSE: A method of driving a wafer in a semiconductor fabricating equipment is provided to improve a wafer driving method in the equipment, thereby providing a wafer driving method having a linear uniform distribution. CONSTITUTION: The method comprises the steps of: loading a wafer(102) in a wafer holder(100) in which the wafer is processed; moving the wafer holder in an optional direction at a constant angle; and processing the wafer loaded in the wafer holder. In the method, the optional direction of the wafer holder is a right, left, front and rear side or a combined direction thereof. The constant angle is in the extent of minus 60 degrees to plus 60 degrees. The wafer holder has a slower moving speed at the minus 60 degrees or plus 60 degrees than at zero degree. In the semiconductor fabricating equipment, a semiconductor device is processed by molecule, plasma, and ion beam.
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