PREPARATION METHOD OF FLEXIBLE SUBSTRATE CIRCUIT FILM

摘要

PURPOSE: A method for preparing a flexible substrate circuit film is provided, to reduce the deviation of plating thickness according to the position of Ni in plating and the plating badness in solder resist patterning. CONSTITUTION: The method comprises the steps of forming the copper conductive pattern on copper layer by using photo etching technique; forming nickel plating layer on the copper conductive circuit pattern; forming gold strike plating layer on the nickel plating layer; coating photo solder resist on the polyimide substrate having the conductive pattern of gold strike plating layer to form the solder resist pattern comprising solder ball hole and bonding pad; thermosetting the solder resist; and forming gold plating layer on the gold strike layer exposed by the solder resist pattern.