| 摘要 |
PURPOSE: A chip size package(CSP) and mounting method thereof, and a jig for forming patterns on electrodes of a CSP are provided to reduce contact resistance at contact regions and improve electric characteristics by preventing occurrence of voids at the contact regions during the mounting of the CSP. CONSTITUTION: A method of mounting a CSP(20) on a printed circuit board(PCB)(30) is provided, wherein a plurality of electrodes(24) protruding from the bottom surface of the CSP are to be attached to cream solders(34) provided on the contact electrodes(32) of the PCB. Uneven patterns are formed on the tips of the electrodes of the CSP. Cream solders are coated on the contact electrodes of the PCB. The electrodes of the CSP having uneven patterns formed thereon are attached to the contact electrodes of the PCB. Preferably, a jig having unevenness is used to form uneven patterns on the tips of the electrodes of the CSP by pressing the electrodes of the CSP down on the unevenness of the jig.
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