发明名称 |
Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
摘要 |
A metal-base multilayer circuit substrate has a metal plate and a circuit substrate bonded to the metal plate, by an insulating adhesive layer containing at least one of metal oxides and/or at least one of metal nitrides. The adhesive layer has high heat conductivity and allows for a metal-base multilayer circuit substrate having excellent heat dissipating properties. |
申请公布号 |
US6175084(B1) |
申请公布日期 |
2001.01.16 |
申请号 |
US19960629229 |
申请日期 |
1996.04.08 |
申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
SAITOH TOSHIKI;YONEMURA NAOMI;MIYAKOSHI TOMOHIRO;FUKUDA MAKOTO |
分类号 |
H01L23/14;H05K1/02;H05K1/05;H05K1/18;H05K3/00;H05K3/30;H05K3/46;(IPC1-7):H05K1/00 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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