METHOD FOR MANUFACTURING POLY-SILICON SINGLE ELECTRON DEVICE VIA EXCIMER-LASER IRRADIATION

摘要

PURPOSE: A method for manufacturing poly-silicon single electron device via excimer-laser irradiation is provided to obtain poly-silicon islands whose size and location are precisely controlled and to form a single electron memory using the same by applying a lithography technique and an excimer laser annealing. CONSTITUTION: An amorphous silicon layer(4), an insulating layer(2) and a buffer layer(8) are successively formed on a substrate. The buffer layer is photo-etched to pattern a window in tip shape. To crystalize the amorphous silicon, annealing by irradiation of laser energy is carried out so that at least one poly silicon grain grows and is isolated around the center portion of the patterned tip to form a large fine-grain poly silicon quantum dot(40). The substrate consists of silicon material. The excimer laser is irradiated under 250deg.C of substrate temperature and 200mJ/cm¬2 of energy level. The quantum dot is an element of poly silicon single electron device.