METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP PACKAGES FOR METAL LID PACKAGE

摘要

PURPOSE: A method for manufacturing semiconductor chip packages for metal lid package is provided to reduce a residual humidity in the package. CONSTITUTION: A semiconductor chip packages manufacturing method packages the semiconductor chip with a metal lid, by mounting the semiconductor chip in which a cavity are formed. The semiconductor chip is applied with silver glass(25) for hardening below 340 deg. C. and the semiconductor chip is attached to the cavity(31) of the package body(30). The silver glass is hardened to fasten the semiconductor chip. A circuit pattern(33) exposed in the semiconductor chip and the cavity of the package body is connected by means of conductive metals(60). A metal lid(50) in which the package body and a solder plating layer(55) are formed is attached and is then experienced by atmosphere temperature in which the solder is melted, so that the internal space(70) of the metal lid is sealed.