THERMAL TREATMENT APPARATUS FOR WAFER AND METHOD THEREOF

摘要

PURPOSE: A thermal treatment apparatus is provided to solve the problem of bottle-neck phenomenon occurring during semiconductor manufacture process, by thermally processing in parallel wafers using a plural set of thermal treatment apparatus. CONSTITUTION: A thermal treatment apparatus includes a thermal transfer plate(20) and spacers(30) installed projectedly against an upper face of the thermal transfer plate, for oppositely supporting with a separated state the thermal transfer plate. The spacers is each installed to control independently the projection height against the upper face of the thermal transfer plate so that the distance between the wafer supported by the spacers and the thermal transfer plate and the grade of the wafer to the thermal transfer plate could be controlled.