SEMICONDUCTOR CHIP, MANUFACTURING METHOD THEREOF AND METHOD OF STACKING SEMICONDUCTOR CHIP

摘要

PURPOSE: A semiconductor chip, a manufacturing method thereof and a method of stacking the semiconductor chip are provided to cut a wafer with an etching and back-lap process instead of a sawing and back-lap process to reduce a thickness of the chip, and facilely electrically connect the chips when stacking the chips. CONSTITUTION: The device comprises a semiconductor substrate(120) having a desired thickness between an upper face and a lower face thereof; an internal metal wire(130) formed on an upper face of the semiconductor substrate and including an electrode pad(150); an insulation protecting film(140) formed on the upper face of the semiconductor substrate except the electrode pad; and an external metal wire(170) formed on the insulation protecting film. In the chip, the desired thickness is below 50 Um. A method of stacking the semiconductor chip comprises the steps of; preparing the plurality of semiconductor chips; bonding each chip on an upper face of other chip in order; and connecting each external metal wire at the side of the chip with a conductive interconnector.