发明名称 METHOD OF REMOVING SACRIFICIAL LAYER OF MICRO WORKING-ELEMENT
摘要 PURPOSE: A method of removing a sacrificial layer of a micro working-element is to remove the sacrificial layer as fast as possible, thereby decreasing a manufacturing cost in a mass production. CONSTITUTION: A method of removing a sacrificial layer of a micro working-element comprises the steps of: forming sequentially a lower electrode, the sacrificial layer, a membrane and an upper electrode on a substrate with a predetermined pattern; exposing a part of the sacrificial layer by removing the upper electrode and the membrane in a predetermined area; forming the first metal for electrically connecting to the exposed sacrificial layer; immersing the substrate having the sacrificial layer in an acid solution; and removing the sacrificial and the first electrode for by contacting the first metal with a second metal. The sacrificial layer is Al, and the first metal is Cr. The second metal is selected from the one of Al, Zn and Ti.
申请公布号 KR20010002913(A) 申请公布日期 2001.01.15
申请号 KR19990022976 申请日期 1999.06.18
申请人 LG ELECTRONICS INC. 发明人 BOO, JONG UK;PARK, JAE YEONG
分类号 H01L21/46;(IPC1-7):H01L21/46 主分类号 H01L21/46
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